CAN WU

Postdoctoral scholar, Stanford University

canwu@stanford.edu

Shriram Center, 443 Via Ortega, Stanford, CA, 94305

[Google Scholar] [Linkedin]

Research Interest

Metal-oxide thin-film electronics | 2.5D heterogeneous integration | 3D monolithic integration | Advanced packaging | RF devices, circuits, and systems | Bioelectronics

Appointment

Postdoc, Department of Chemical Engineering, Stanford University, CA, USA 2021/8 - present

Advisor: Zhenan Bao

Research topic: soft, stretchable, large-area electronics for human-machine/biomedical interface

Education

Ph.D., Department of Electrical and Computer Engineering, Princeton University, NJ, USA 2016/7 - 2021/7

Advisors: Naveen Verma, James C. Sturm, and Sigurd Wagner

Thesis topic: giga-Hertz large-area electronics for wireless-sensing applications

Master, Department of Electrical Engineering, Princeton University, NJ, USA 2014/9 - 2016/7

Undergraduate, Institute of Microelectronics, Tsinghua University, Beijing, China 2009/9 - 2013/6

News

2025/3/12 Today I learned our work was discussed as a frontier flexible technology in a lecture at Stanford EE240 course. I call this a milestone, cheers!
2024/10 Our invited paper, entitled "Skin-Inspired Sensors and Integrated Circuits for Wearables and Implantables", will appear in 2024 IEEE International Electron Devices Meeting (IEDM), Focus Session on Advanced Neurotechnologies and Human-Machine Interfaces.
2024/7 I am invited to give a talk at 31st International Workshop on Active-Matrix Flat-panel Displays and Devices, entitled "Enabling High Performance and Strain Insensitivity in Intrinsically Stretchable Carbon-Nanotube Thin-Film Transistors".
2024/3 Our work, on intrinsically stretchable carbon-nanotube thin-film transistors, is published in Nature. For the first time, the performance of stretchable transistors rivals that of conventional flexible ones. This work paves the way for next-generation large-scale, biocompatible electrophysiology sensing tools.

The work is featured in Nature Review Electrical Engineering, IEEE Spectrum, Stanford News, Tech Explore, EurekAlert, Bioengineer, Nature Asia, Mirage News.

2024/3 Our paper, entitled "Strain-Induced Performance Variation in Stretchable Carbon-Nanotube Thin-Film Transistors and the Solution through a Circular Channel Design", is published in IEEE Transactions on Electron Devices (special issue). We develop a simple but effective geometry design to mitigate strain effect on stretchable transistors.
2023/11 I present a poster in the System X conference at Stanford University, on our recent development of stretchable electronics for human-cyber interfaces.
2023/10 Our paper, entitled "A Monolithic-Integrable Reconfigurable Antenna based on Large-Area Electronics" is published in IEEE Journal of Solid-State Circuits (JSSC).
2023/9 Our paper, entitled "A Device Design Approach to Mitigate Strain Impact on Stretchable Carbon-Nanotube Thin-Film Transistors" is accepted to 2023 IEEE International Electron Device Meeting (IEDM). It is among top ranked student papers!
2023/8 Our proposal on development of a high-density sEMG sensing array is funded.
2023/3 I share my perspective on future intelligent sensing as a panelist at the Open House on Nano/Microelectronics workshop at SLAC National Lab.
2022/11 I give a joint talk at the System X conference at Stanford University, on our recent development of stretchable devices a circuits for human-machine interface.
2021/11 I give a talk at Westlake University, entitled “Large-Area Electronics for Wireless-Sensing Applications".
2021/10 A News & Views article in Nature Electronics, entitled "Oxide electronics for 5G and 6G", reviews our work on a gigahertz large area electronics-based phased array.
2021/10 Our work on a gigahertz large-area electronics-based phased array is published online in Nature Electronics.
2021/8 I join Stanford University as a postdoc. My research will focus on developing stretchable electronic for electrophysiological-sensing tools for human-machine interface applications.
2021/7 I give a talk at Peking University, entitled "Device, Circuit, and System Co-Designs for Gigahertz Large-Area Electronics".
2021/7 I defend my Ph.D. !
2021/7 I am invited to give a talk at 28th International Workshop on Active-Matrix Flat-panel Displays and Devices, entitled "Gigahertz Large-Area Electronic Devices and Circuits for Wireless Applications".
2021/3 Our work on REITS, a wireless system to improve radar-signal reflections for enhancing self-driving vehicle safety, is reported on NewScientist.
2020/12 I present our work on gigahertz large-area electronics RF switch and its application to reconfigurable antennas at IEEE International Electron Devices Conference (IEDM).

Invited talks, seminars, and system demos

"Enabling High Performance and Strain Insensitivity in Intrinsically Stretchable Carbon-Nanotube Thin-Film Transistors", 31st International Workshop on Active-Matrix Flat-panel Displays and Devices, online, Jul. 2024.
"Stretchable, Large-Area Electronics for Electrophysiological Sensing", SLAC Nano/Microelectronics Workshop, CA, USA, Mar. 2023.
“Stretchable Integrated Devices and Circuits for Human-Machine Interface", System X Conference, Stanford University, CA, USA, Nov. 2022.
“Device, Circuit, and System Co-Designs for Gigahertz Large-Area Electronics", Peking University, online, Aug. 2021.
“Large-Area Electronics for Wireless-Sensing Applications", Westlake University, online, Nov. 2021.
"Gigahertz Large-Area Electronic Devices and Circuits for Wireless Applications", 28th International Workshop on Active-Matrix Flat-panel Displays and Devices, online, Jul. 2021.
“Co-design of machine-learning algorithms for control and perception with emerging technologies for structure-preservation in sensor data", Center for Brain-inspired Computing Enabling Autonomous Intelligence (CBRIC) Industry Meeting, online, May 2021.
“Technologies for Enabling Very-large-aperture Phased Arrays for Distributed Sensing and Intelligence", Center for Brain-inspired Computing Enabling Autonomous Intelligence (CBRIC) Industry Meeting, online, Mar. 2019.
“Sensor Data Compression by Large-area Electronics to Reduce Large-area to VLSI Physical Interface Connections in Hybrid Systems", System demonstration at Flex Conference, Monterey, CA, USA, Feb. 2016 (Best Student Poster).